The new Snapdragon 200 processors are manufactured on a 28nm process technology and feature key modem technologies that are important in China and emerging regions, including support for HSPA+ (up to 21Mbps) and TD-SCDMA. It is anticipated that the new processors (8×10 and 8×12), along with its Qualcomm Reference Design counterparts, will be available in late 2013 and are designed to deliver improved performance, graphics-rich gaming experience and advanced multimedia features for high-volume smartphones.
“With the expanded line of Snapdragon 200 processors, Qualcomm Technologies is building on its dual-and quad-core processor portfolio for entry-level smartphones and tablets, bringing key process technology and modem features to all Snapdragon tiers,” said Jeff Lorbeck, senior vice president of product management, Qualcomm Technologies, Inc. “We are excited to offer our customers the broadest range of 3G technologies and superior performance and power-efficiency, enabling them to deliver a wide range of innovative smartphones for the high-volume segment.”
The 200 series offers optimum performance with extended battery life. It will have support for dual cameras, with a maximum 8 Megapixel rear-facing camera and up to 5 Megapixel front-facing camera Interestingly, this also offers Dual SIM and Dual Active also Tri SIM Tri Standby.
The latest additions to the Snapdragon 200 class also feature: class-leading graphics performance with Adreno 302 GPU and Qualcomm Quick Charge. The new set of chipsets will support various platforms such as Windows Phone, Android and Firefox
With these new Snapdragon 200 chips, we would probably see a low-end Windows Phone with a dual Sim support in the future.
With these new Snapdragon 200 chips, we would probably see a low-end Windows Phone with a dual Sim support in the future.
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